Invention Grant
- Patent Title: Relay
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Application No.: US16922130Application Date: 2020-07-07
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Publication No.: US11264195B2Publication Date: 2022-03-01
- Inventor: In Sic Kim , Jong Joo Kim , Sumi Son , Jae Yoon Lim
- Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
- Applicant Address: KR Seoul; KR Seoul
- Assignee: HYUNDAI MOTOR COMPANY,KIA MOTORS CORPORATION
- Current Assignee: HYUNDAI MOTOR COMPANY,KIA MOTORS CORPORATION
- Current Assignee Address: KR Seoul; KR Seoul
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: KR10-2019-0099472 20190814
- Main IPC: H01H50/30
- IPC: H01H50/30 ; H01H50/44 ; H01H50/14 ; H01H50/02

Abstract:
The relay according to an embodiment of the disclosure includes a main body configured to open and close a circuit by an input signal, and a plurality of terminals extending from the main body and coupled to a PCB, wherein each of the plurality of terminals comprises an inclined extension portion configured to allow the main body to be spaced apart from the PCB and maintain an inclined state with respect to a surface of the PCB and a lower surface of the main body, and a coupling portion extending from the inclined extension portion in a direction to enter a coupling slot of the PCB.
Public/Granted literature
- US20210050168A1 RELAY Public/Granted day:2021-02-18
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