Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US16528959Application Date: 2019-08-01
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Publication No.: US11264240B2Publication Date: 2022-03-01
- Inventor: Kenichi Iguchi , Haruo Nakazawa
- Applicant: Fuji Electric Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Fuji Electric Co., Ltd.
- Current Assignee: Fuji Electric Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Chen Yoshimura LLP
- Priority: JPJP2018-158706 20180827
- Main IPC: H01L29/868
- IPC: H01L29/868 ; H01L29/16 ; H01L21/04 ; H01L29/78 ; H01L21/268

Abstract:
A semiconductor device is manufactured by implanting impurity ions in one surface of a semiconductor substrate made of silicon carbide; irradiating a region of the semiconductor substrate implanted with the impurity ions with laser light of a wavelength in the ultraviolet region; and forming, on a surface of a high-concentration impurity layer formed by irradiating with the laser light, an electrode made of metal in ohmic contact with the high-concentration impurity layer. When irradiating with the laser light, a first concentration peak of the impurity ions that exceeds a solubility limit concentration of the impurity ions in silicon carbide is formed in a surface region near the one surface of the semiconductor substrate within the high-concentration impurity layer.
Public/Granted literature
- US20200066528A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2020-02-27
Information query
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