Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US16112943Application Date: 2018-08-27
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Publication No.: US11264380B2Publication Date: 2022-03-01
- Inventor: Hou-Ju Li , Chur-Shyang Fu , Chun-Sheng Liang , Jeng-Ya David Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/08 ; H01L21/762 ; H01L21/8234 ; H01L21/3105 ; H01L21/3213

Abstract:
A semiconductor device includes a substrate, a first active fin, a second active fin, a dummy fin and a first gate structure. The first and the second active fin are on the substrate and extend along a first direction. The dummy fin is disposed between the first active fin and the second active fin, and extends in the first direction. The dummy fin includes a plurality of layers, and each of the layers includes a material different from another layer. The first gate structure crosses over the dummy fin, the first and the second active fins.
Public/Granted literature
- US20200066718A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-02-27
Information query
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