Invention Grant
- Patent Title: Semiconductor structure and method of fabricating the semiconductor structure
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Application No.: US16744811Application Date: 2020-01-16
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Publication No.: US11264486B2Publication Date: 2022-03-01
- Inventor: Chung-Hao Chu , Chia-Chung Chen , Shu Fang Fu , Chi-Feng Huang , Victor Chiang Liang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L21/8234 ; H01L29/78

Abstract:
The present disclosure provides a semiconductor device, including a substrate, a fin over the substrate, wherein the fin extends along a primary direction, a gate over the fin, the gate extends along the secondary direction orthogonal to the primary direction, a first conductive contact over the gate, and a conductive routing layer over the first conductive contact, wherein at least a portion of the fin is free from the coverage of a vertical projection of the conductive routing layer.
Public/Granted literature
- US20210226043A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SEMICONDUCTOR STRUCTURE Public/Granted day:2021-07-22
Information query
IPC分类: