Invention Grant
- Patent Title: Thin film transistor and manufacturing method thereof
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Application No.: US16626341Application Date: 2019-11-08
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Publication No.: US11264510B2Publication Date: 2022-03-01
- Inventor: Fangmei Liu
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN201911003341.3 20191022
- International Application: PCT/CN2019/116538 WO 20191108
- International Announcement: WO2021/077471 WO 20210429
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/02 ; H01L29/66 ; H01L27/32

Abstract:
The present disclosure provides a thin film transistor and a manufacturing method thereof. The thin film transistor includes a substrate, a light shielding layer, an intermediate buffer layer, and a buffer layer, wherein the light shielding layer is formed on the substrate, the buffer layer is located above the substrate and the light shielding layer, the intermediate buffer layer is formed between the buffer layer and the light shielding layer, and the intermediate buffer layer is made of ceramic material.
Public/Granted literature
- US20210336062A1 THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-10-28
Information query
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