Invention Grant
- Patent Title: Light emitting device, light emitting module, method of manufacturing light emitting device, and method of manufacturing light emitting module
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Application No.: US16670539Application Date: 2019-10-31
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Publication No.: US11264552B2Publication Date: 2022-03-01
- Inventor: Shinichi Daikoku , Toru Hashimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Hunton Andrews Kurth LLP
- Priority: JPJP2018-206190 20181031,JPJP2019-192742 20191023
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/38 ; H01L33/50 ; H01L33/58 ; H01L33/60
Abstract:
The light emitting device includes: a light emitting element, a covering member, a pair of electrode layers, and a pair of electrode terminals. The light emitting element has an electrode-formed surface on which a pair of electrode posts are formed. The covering member covers an electrode-formed surface of the light emitting element while forming an exposed portion of each of the pair of electrode posts which is exposed from the covering member. The pair of electrode layers are provided on a surface of the covering member and electrically connected to the exposed portions of the pair of electrode posts. The pair of electrode terminals are electrically connected to the pair of electrode layers, and provided on the surface of the covering member. The pair of electrode terminals are thicker than the pair of electrode layers, and are disposed at an interval larger than an interval between the pair of electrode posts.
Information query
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