Invention Grant
- Patent Title: Semiconductor device and semiconductor module
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Application No.: US16233660Application Date: 2018-12-27
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Publication No.: US11264838B2Publication Date: 2022-03-01
- Inventor: Koji Morita
- Applicant: LAPIS SEMICONDUCTOR CO., LTD
- Applicant Address: JP Kanagawa
- Assignee: LAPIS SEMICONDUCTOR CO., LTD
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD
- Current Assignee Address: JP Kanagawa
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: JPJP2018-000133 20180104
- Main IPC: H02J50/12
- IPC: H02J50/12 ; H02J50/80 ; H02J7/02 ; H04W4/80
Abstract:
A semiconductor device formed in a single semiconductor integrated circuit, the semiconductor device including: a transmission signal circuit block; a reception signal circuit block; a signal processing circuit block; and at least one of a charging control circuit block or a monitoring circuit block.
Public/Granted literature
- US20190207426A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE Public/Granted day:2019-07-04
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