A headphone assembly, including: a switching element for controlling a switch of at least one functional element in a headphone; a pressure sensor accommodated in a groove of a speaker board; and an ear pad covering the groove, when the ear pad is pressed, a trigger element may be moved to press against the pressure sensor, when detecting that pressure applied by the trigger element reaches a predetermined range, the pressure sensor switches on the switching element, otherwise, the pressure sensor switches off the switching element.