Invention Grant
- Patent Title: Component mounting method and component mounting apparatus
-
Application No.: US17131995Application Date: 2020-12-23
-
Publication No.: US11266026B2Publication Date: 2022-03-01
- Inventor: Ryota Inoue , Naoki Azuma
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2015-036520 20150226
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K13/04 ; H05K13/08 ; H05K3/20

Abstract:
A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
Public/Granted literature
- US20210112667A1 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS Public/Granted day:2021-04-15
Information query