A laser welding by-product removal device comprises a housing that includes distal and proximate ends separated along a central axis by a peripheral sidewall. A first plenum circumscribes the peripheral sidewall at the proximate housing end and includes a gas inlet and a first plenum base surface that includes a plurality of gas outlet holes. A second plenum circumscribes the peripheral sidewall between the first plenum and the distal housing end, where the second plenum includes a second plenum base surface, radially inner and outer sidewalls that extend axially distal from the second plenum base surface. The second plenum includes a top surface extending between the radially inner and outer sidewalls, and a by-product outlet in the top surface, where at least one of the second plenum base surface and the radially outer sidewall includes a plurality of by-product inlet holes.