Invention Grant
- Patent Title: Nail plater apparatus and related methods
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Application No.: US16564095Application Date: 2019-09-09
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Publication No.: US11267088B2Publication Date: 2022-03-08
- Inventor: Dwight Bryan Whitfield, Sr. , Frank S. Lusczakoski
- Applicant: CHEP Technology Pty Limited
- Applicant Address: AU Sydney
- Assignee: CHEP Technology Pty Limited
- Current Assignee: CHEP Technology Pty Limited
- Current Assignee Address: AU Sydney
- Agency: Allen, Dyer, Doppelt + Gilchrist, PA
- Main IPC: B23P19/04
- IPC: B23P19/04 ; B27M3/00 ; B27F7/00 ; B27F7/15 ; B23P19/00 ; B65D19/00 ; B65D19/38 ; F16B15/00
Abstract:
A nail plater apparatus includes at least one nail plate magazine configured to hold a plurality of nail plates, and at least one nail plate extractor assembly associated with the at least one nail plate magazine and configured to position at least one nail plate therefrom to at least one nail plate pressing area. A board feeder is configured to position a board to a board receiving area. At least one nail plate presser assembly is adjacent the board receiving area and aligned with the at least one nail plate pressing area and configured to press the at least one nail plate into the board.
Public/Granted literature
- US20200001413A1 NAIL PLATER APPARATUS AND RELATED METHODS Public/Granted day:2020-01-02
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