Invention Grant
- Patent Title: Chemical mechanical planarization membrane
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Application No.: US15994088Application Date: 2018-05-31
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Publication No.: US11267099B2Publication Date: 2022-03-08
- Inventor: Cheng-Ping Chen , Ren-Dou Lee , Sheng-Tai Peng , Tsung-Lung Lai , Tzi-Yi Shieh , Chien-Wei Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: B24B37/32
- IPC: B24B37/32 ; B24B37/20 ; B24B37/015 ; H01L21/321

Abstract:
In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.
Public/Granted literature
- US20190091829A1 CHEMICAL MECHANICAL PLANARIZATION MEMBRANE Public/Granted day:2019-03-28
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