Invention Grant
- Patent Title: Structure forming apparatus, structure manufacturing method, and structure
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Application No.: US13849949Application Date: 2013-03-25
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Publication No.: US11267168B2Publication Date: 2022-03-08
- Inventor: Hiroyuki Yasukochi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2012-073796 20120328
- Main IPC: B29C35/08
- IPC: B29C35/08 ; B29C35/10 ; B29C37/00

Abstract:
A structure forming apparatus includes a rotary body, an irradiation unit, and a holding member. On the rotary body, a mask that is subjected to patterning is capable of being disposed. The irradiation unit is capable of irradiating an area along an axis direction of a rotation of the rotary body with an energy line with the mask intervened therebetween. The holding member is disposed to be opposed to the rotary body so that a holding area that holds a material cured with the energy line is formed.
Public/Granted literature
- US20130260110A1 STRUCTURE FORMING APPARATUS, STRUCTURE MANUFACTURING METHOD, AND STRUCTURE Public/Granted day:2013-10-03
Information query
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