Invention Grant
- Patent Title: Die, manufacturing method therefor, and molded body manufacturing method
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Application No.: US16333014Application Date: 2017-09-22
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Publication No.: US11267187B2Publication Date: 2022-03-08
- Inventor: Tatsuya Fukuda , Yuki Harasawa , Ryosuke Oki
- Applicant: KYORAKU CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: KYORAKU CO., LTD.
- Current Assignee: KYORAKU CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Maier & Maier, PLLC
- Priority: JPJP2016-191927 20160929
- International Application: PCT/JP2017/034276 WO 20170922
- International Announcement: WO2018/062034 WO 20180405
- Main IPC: B29C51/36
- IPC: B29C51/36 ; B29C33/38 ; B29C51/02 ; B29C51/10 ; B29C65/00 ; B29K101/12 ; B29C51/26 ; B29C48/375 ; B29C48/07 ; B29L7/00 ; B29C48/00 ; B23P15/24 ; B29K105/04 ; B29C51/12 ; B29C48/475

Abstract:
A mold which can improve an appearance of a molded body is provided. A mold includes a cavity, the mold being capable of subjecting a resin sheet under reduced pressure suction via a plurality of reduced pressure suction holes thereby shaping the resin sheet to follow a shape of an inner surface of the cavity; wherein: the inner surface includes a base surface and a plurality of island-like concave portions provided in the base surface; and a concave portion reduced pressure suction hole index defined by an in-concave reduced pressure suction hole ratio divided by a concave portion area ratio is 0.5 or lower.
Public/Granted literature
- US20190275728A1 DIE, MANUFACTURING METHOD THEREFOR, AND MOLDED BODY MANUFACTURING METHOD Public/Granted day:2019-09-12
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