A head module includes: a plurality of heads, a base on which the plurality of heads is arrayed in a head array direction, a plurality of individual heatsinks respectively attached to the plurality of heads, and a common heatsink standing on the base, the common heatsink including a connector thermally connected to each of the plurality of individual heatsinks. The connector of the common heatsink is along the head array direction and is adjacent to each of the plurality of individual heatsinks in a direction perpendicular to the head array direction.