Invention Grant
- Patent Title: Packaging device
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Application No.: US16389448Application Date: 2019-04-19
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Publication No.: US11267626B2Publication Date: 2022-03-08
- Inventor: Brian C. Dais , Brian T. Davis , Jose Porchia , Rajarajan Ravichandran , Jennifer Shcherban
- Applicant: S. C. Johnson & Son, Inc.
- Applicant Address: US WI Racine
- Assignee: S. C. Johnson & Son, Inc.
- Current Assignee: S. C. Johnson & Son, Inc.
- Current Assignee Address: US WI Racine
- Main IPC: B65D73/00
- IPC: B65D73/00

Abstract:
A packaging device includes a first portion and a second portion connected to the first portion by way of a first fold line. The first portion includes a first primary edge opposite the first fold line. First and second secondary edges extend between the first fold line and the first primary edge, and an attachment mechanism is provided adjacent the first primary edge. The second portion includes a second primary edge opposite the first fold line. Third and fourth secondary edges extend between the first fold line and the second primary edge. An arm is defined by two cut lines extending from a section of the second portion closer to the first fold line than the second primary edge, and ending in a tab that extends beyond a distal end of the second primary edge.
Public/Granted literature
- US20200331679A1 PACKAGING DEVICE Public/Granted day:2020-10-22
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