Invention Grant
- Patent Title: Rapid processing of laminar composite components
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Application No.: US16416042Application Date: 2019-05-17
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Publication No.: US11267763B2Publication Date: 2022-03-08
- Inventor: Wayde R. Schmidt , Paul Sheedy
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P. A.
- Main IPC: C04B35/08
- IPC: C04B35/08 ; C04B35/64 ; C04B35/626 ; C04B35/628 ; C04B35/657 ; F01D5/02 ; F01D5/14 ; F01D9/02 ; F01D25/08 ; F01D25/24 ; F23R3/00

Abstract:
A method of manufacturing a CMC structure includes infiltrating a porous substrate with a composite material and performing a first densification on the infiltrated porous substrate, forming a first densified porous substrate, wherein the first densification includes techniques selected from the group of techniques comprising photonic curing, photonic sintering, pulsed thermal heating, or combinations thereof.
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