Invention Grant
- Patent Title: Polyamide-imide film
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Application No.: US16477730Application Date: 2018-02-02
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Publication No.: US11267942B2Publication Date: 2022-03-08
- Inventor: Sunhwan Kim , Dae Seong Oh , Jin Woo Lee , Dawoo Jeong , Dong Jin Lim
- Applicant: SKC CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SKC CO., LTD.
- Current Assignee: SKC CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0017550 20170208,KR10-2017-0043474 20170404
- International Application: PCT/KR2018/001467 WO 20180202
- International Announcement: WO2018/147602 WO 20180816
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C08J5/18 ; B29C39/24 ; B29C39/38 ; B29C39/42 ; B29C39/44 ; C08G73/10 ; C08L79/08 ; B29C41/00 ; B29K77/00 ; B29K105/00

Abstract:
One embodiment may provide a polyamide-imide film which is colorless and transparent while having an adequate level of solubility and excellent mechanical properties, the polyamide-imide film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, for a square cross-section of 1 cm×1 cm and a thickness of 30 um to 100 mm, the polyamide-imide film has a dissolution time of 5-60 minutes in 10 ml of dimethylacetamide (DMAc), and for a thickness of 50 mm, the polyamide-imide film has a yellowness of at most 5, a haze of at most 2%, a permeability of at least 85% and a modulus of at least 5.0 GPa.
Information query
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