Invention Grant
- Patent Title: Polishing liquid and chemical mechanical polishing method
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Application No.: US16939189Application Date: 2020-07-27
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Publication No.: US11267988B2Publication Date: 2022-03-08
- Inventor: Tetsuya Kamimura
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-057228 20180323
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C08K3/36 ; H01L21/306

Abstract:
A polishing liquid is a polishing liquid used for chemical mechanical polishing, the polishing liquid including colloidal silica; and a buffering agent excluding phosphoric acid, in which the buffering agent is a compound having a pKa within a range of X±1 in a case where a pH of the polishing liquid is denoted by X, a zeta potential of the colloidal silica measured in a state where the colloidal silica is present in the polishing liquid is −20 mV or less, an electrical conductivity is 200 μS/cm or more, and a pH is 2 to 6.
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