Invention Grant
- Patent Title: Polishing liquid and chemical mechanical polishing method
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Application No.: US16984270Application Date: 2020-08-04
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Publication No.: US11267989B2Publication Date: 2022-03-08
- Inventor: Tetsuya Kamimura
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-057175 20180323
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C08K3/36 ; C08K5/09 ; C08K5/3442 ; C08K5/3467 ; C08K5/41 ; C08K5/51 ; C09K3/14 ; H01L21/306

Abstract:
A polishing liquid used for chemical mechanical polishing includes colloidal silica, in which a zeta potential of the colloidal silica measured in a state where the colloidal silica is present in the polishing liquid is −20 mV or less, an electrical conductivity is 200 μS/cm or less, a pH is 2 to 6, and a transmittance is 70% to 99%.
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