Invention Grant
- Patent Title: Tin or tin alloy plating solution
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Application No.: US16757872Application Date: 2018-10-23
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Publication No.: US11268203B2Publication Date: 2022-03-08
- Inventor: Mami Watanabe , Kyoka Susuki , Kiyotaka Nakaya
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JPJP2017-205201 20171024,JPJP2018-197081 20181019
- International Application: PCT/JP2018/039333 WO 20181023
- International Announcement: WO2019/082885 WO 20190502
- Main IPC: C25D3/32
- IPC: C25D3/32 ; C25D7/00 ; H05K3/18

Abstract:
A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is CaH2a+1 (where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p+q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.
Public/Granted literature
- US20200378025A1 TIN OR TIN ALLOY PLATING SOLUTION Public/Granted day:2020-12-03
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