Invention Grant
- Patent Title: Detecting and correcting deficiencies in surface conditions for bonding applications
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Application No.: US16182719Application Date: 2018-11-07
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Publication No.: US11268809B2Publication Date: 2022-03-08
- Inventor: Jennifer Bennett , James D. Bielick , David J. Braun , Timothy P. Younger , Theron L. Lewis , Stephen M. Hugo , John R. Dangler , Timothy A. Bartsch
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Law Office of Jim Boice
- Main IPC: G01B21/30
- IPC: G01B21/30

Abstract:
A method adjusts a mechanical process on a material in order to improve bonding characteristics of the material. A system collects surface micro-roughness measurements of a material, and places discrete sampling regions on the material. The system analyzes the surface micro-roughness measurements for each of the discrete sampling regions on the material, and identifies a lowest micro-roughness measurement in a discrete sampling region from a plurality of discrete sampling regions on the material. The system compares the lowest micro-roughness measurement to a threshold micro-roughness measurement in order to determine that the lowest micro-roughness measurement is less than the threshold micro-roughness measurement. In response to determining that the lowest micro-roughness measurement is less than the threshold micro-roughness measurement, the system adjusts a mechanical process on the material until micro-roughness measurements for each of the discrete sampling regions are greater than the threshold micro-roughness measurement.
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