Invention Grant
- Patent Title: Temperature sensor and device provided with temperature sensor
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Application No.: US16309461Application Date: 2017-06-14
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Publication No.: US11268862B2Publication Date: 2022-03-08
- Inventor: Takehiro Baba
- Applicant: SEMITEC Corporation
- Applicant Address: JP Tokyo
- Assignee: SEMITEC Corporation
- Current Assignee: SEMITEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2016-130025 20160630
- International Application: PCT/JP2017/021930 WO 20170614
- International Announcement: WO2018/003497 WO 20180104
- Main IPC: G01K1/08
- IPC: G01K1/08 ; G01K7/22 ; H01C1/028

Abstract:
The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5×10−6/° C.; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5×10−6/° C. and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).
Public/Granted literature
- US11237061B2 Temperature sensor and device provided with temperature sensor Public/Granted day:2022-02-01
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