Invention Grant
- Patent Title: Shield structure for pressure sensor, and pressure sensor provided with same
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Application No.: US16767004Application Date: 2018-11-13
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Publication No.: US11268873B2Publication Date: 2022-03-08
- Inventor: Kazuya Takimoto , Tatsuya Tanaka , Tomoharu Oba
- Applicant: Saginomiya Seisakusho, Inc.
- Applicant Address: JP Tokyo
- Assignee: Saginomiya Seisakusho, Inc.
- Current Assignee: Saginomiya Seisakusho, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JPJP2017-230548 20171130
- International Application: PCT/JP2018/041952 WO 20181113
- International Announcement: WO2019/107140 WO 20190606
- Main IPC: G01L19/14
- IPC: G01L19/14 ; G01L9/00
Abstract:
In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).
Public/Granted literature
- US20210003469A1 Shield Structure for Pressure Sensor, and Pressure Sensor Provided with Same Public/Granted day:2021-01-07
Information query
