Invention Grant
- Patent Title: Detection substrate, assembly, and method for manufacturing detection substrate
-
Application No.: US16766277Application Date: 2017-11-24
-
Publication No.: US11268988B2Publication Date: 2022-03-08
- Inventor: Kazuyuki Sashida , Kenichi Suzuki , Mizue Yamaji , Kenichi Yoshida , Shinji Kunori
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/042132 WO 20171124
- International Announcement: WO2019/102571 WO 20190531
- Main IPC: G01R15/18
- IPC: G01R15/18 ; G01R19/00

Abstract:
A detection substrate 150 has a body film 1a having a through hole 91; a winding wire part 10 provided on a surface of one side of the body film 1a, on a surface of another side of the body film 1a and in the through hole 91, and disposed so as to surround a current to be detected; and a winding return wire part 50, provided on the body film 1a, connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side.
Public/Granted literature
- US20200371137A1 DETECTION SUBSTRATE, ASSEMBLY, AND METHOD FOR PRODUCING DETECTION SUBSTRATE Public/Granted day:2020-11-26
Information query