Invention Grant
- Patent Title: High-voltage lead-through device and arrangement for handling data of a high-voltage lead-through device
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Application No.: US17294089Application Date: 2019-11-15
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Publication No.: US11269002B2Publication Date: 2022-03-08
- Inventor: Cecilia Forssén , Joachim Schiessling , Peter Sjöberg , Andrew Maxwell
- Applicant: Hitachi Energy Switzerland AG
- Applicant Address: CH Baden
- Assignee: Hitachi Energy Switzerland AG
- Current Assignee: Hitachi Energy Switzerland AG
- Current Assignee Address: CH Baden
- Agency: Sage Patent Group
- Priority: EP18206505 20181115
- International Application: PCT/EP2019/081429 WO 20191115
- International Announcement: WO2020/099615 WO 20200522
- Main IPC: H01H31/12
- IPC: H01H31/12 ; G01R31/12 ; H01B17/26 ; H01F27/04

Abstract:
A high-voltage lead-through device includes an insulator body having a solid exterior and including insulation, a main conductor passing therethrough, a sensor adjacent the main conductor inside the insulator body measuring a physical property of the device and a communication unit adjacent the main conductor outside the insulator body, wherein the main conductor has a first electric potential, a section of the solid exterior of the insulator body faces a second electric potential, the communication unit is connected to the sensor using a signal conductor as a first electrical communication medium and the communication unit employs a different communication medium for communicating with a data distribution device at a third electric potential.
Public/Granted literature
- US20210356509A1 HIGH-VOLTAGE LEAD-THROUGH DEVICE AND ARRANGEMENT FOR HANDLING DATA OF A HIGH-VOLTAGE LEAD-THROUGH DEVICE Public/Granted day:2021-11-18
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