Invention Grant
- Patent Title: System and method for monitoring semiconductor manufacturing equipment via analysis unit
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Application No.: US16787473Application Date: 2020-02-11
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Publication No.: US11269003B2Publication Date: 2022-03-08
- Inventor: Ching-Chih Lin , Chun-Wei Wu
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G08B29/04 ; G01R31/28 ; G01D18/00

Abstract:
The present disclosure provides a system and a method for monitoring semiconductor manufacturing equipment. The system includes a sensor, a circuit, and an analysis unit. The sensor provides a sensor signal. The circuit receives the sensor signal and generates an input signal. The analysis unit includes a signal management platform, receiving the input signal and performing a first data process to generate a first data signal; a diagnosis subsystem, receiving the first data signal from the signal management platform and performing a health status monitoring process to generate a second data signal; and a decision subsystem, performing a determination process to generate a third data signal according to the second data signal from the diagnosis subsystem. The diagnosis subsystem generates a feedback signal according to the third data signal, and the signal management platform transmits the feedback signal to the semiconductor manufacturing equipment.
Public/Granted literature
- US20210247438A1 SYSTEM AND METHOD FOR MONITORING SEMICONDUCTOR MANUFACTURING EQUIPMENT Public/Granted day:2021-08-12
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