Invention Grant
- Patent Title: Magnetic sensor
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Application No.: US16613671Application Date: 2018-05-14
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Publication No.: US11269024B2Publication Date: 2022-03-08
- Inventor: Kei Tanabe
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & emery LLP
- Priority: JPJP2017-097362 20170516
- International Application: PCT/JP2018/018543 WO 20180514
- International Announcement: WO2018/212131 WO 20181122
- Main IPC: G01R33/09
- IPC: G01R33/09 ; H05K1/18 ; H01F7/20

Abstract:
To provide a magnetic sensor capable of supporting a magnetic block stably and allowing a further size reduction of the sensor chip. A magnetic sensor includes a sensor chip and a magnetic block which are mounted on a circuit board. The sensor chip is mounted on the circuit board such that a mounted surface thereof faces a mounting surface, and the magnetic block is mounted on the circuit board such that first and second surfaces and face an element formation surface and the mounting surface, respectively. The magnetic block has a cutout portion, and some of terminal electrodes E11 to E16 are disposed within a space formed by the cutout portion. According to the present invention, the magnetic block can be supported stably. In addition, the presence of the cutout portion in the magnetic block allows a further size reduction of the sensor chip.
Public/Granted literature
- US20210003642A1 MAGNETIC SENSOR Public/Granted day:2021-01-07
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