Provided is an imaging apparatus having: an imaging optical system including at least one optical element; an image sensor configured to capture an object image formed by the imaging optical system; a substrate on which an image sensor is mounted; a holding member configured to hold the imaging optical system, the holding member including a substrate bonding face that is bonded to the substrate; a first bonding member configured to bond at least a part of a first face of the substrate, that faces the substrate bonding face, to the substrate bonding face; and a second bonding member configured to bond at least a part of a second face of the substrate, that is opposite to the first face of the substrate, to the substrate bonding face.