An electronic device is provided. The electronic device includes a first substrate, a second substrate, a third substrate and a fourth substrate. The first substrate includes a first portion. The second substrate is disposed on the first substrate, and the first portion protrudes outward a boundary of the second substrate. The third substrate is disposed adjacent to the first substrate. The fourth substrate is disposed on the third substrate and includes a second portion protruding outward a boundary of the third substrate. The second portion overlaps the first portion. The first substrate includes a first side surface facing the third substrate. The fourth substrate includes a second side surface facing the second substrate. The first side surface and the second side surface are at least partially grinded.