Invention Grant
- Patent Title: Production method for antenna substrate, production method for antenna substrate with wiring line and electrode, and production method for RFID element
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Application No.: US15743199Application Date: 2016-08-10
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Publication No.: US11269254B2Publication Date: 2022-03-08
- Inventor: Junji Wakita , Hiroji Shimizu , Seiichiro Murase
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2015-162813 20150820
- International Application: PCT/JP2016/073613 WO 20160810
- International Announcement: WO2017/030070 WO 20170223
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/031 ; H01L29/786 ; H01L51/05 ; H05K1/09 ; H01P11/00 ; H05K1/16 ; G06K19/077 ; G03F7/004 ; G03F7/038 ; G03F7/09 ; G03F7/095 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; H01L21/48 ; H01L23/66 ; H01Q1/38 ; G03F7/027 ; B82Y30/00 ; B82Y40/00 ; H01L51/00 ; H01Q1/22 ; H01Q7/00

Abstract:
An object of the present invention is to provide a method for accurately forming an antenna substrate as well as an antenna substrate with wiring line and electrode by a coating method. One aspect of the present invention provides a method for producing an antenna substrate with wiring line and electrode including the steps of: (1) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate; (2-A) processing the coating film into a pattern corresponding to an antenna by photolithography; (2-B) processing the coating film into a pattern corresponding to a wiring line; (2-C) processing the coating film into a pattern corresponding to an electrode; (3-A) curing the pattern corresponding to an antenna into an antenna; (3-B) curing the pattern corresponding to a wiring line into a wiring line; and (3-C) curing the pattern corresponding to an electrode into an electrode.
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