Invention Grant
- Patent Title: Method and assembly for characterizing a mask or a wafer for microlithography
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Application No.: US17164747Application Date: 2021-02-01
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Publication No.: US11269260B2Publication Date: 2022-03-08
- Inventor: Michael Carl , Martin Voelcker
- Applicant: Carl Zeiss SMT GmbH
- Applicant Address: DE Oberkochen
- Assignee: Carl Zeiss SMT GmbH
- Current Assignee: Carl Zeiss SMT GmbH
- Current Assignee Address: DE Oberkochen
- Agency: Fish & Richardson P.C.
- Priority: DE102018213127.9 20180806
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A method includes using an illumination device to illuminate an object with electromagnetic radiation produced by a radiation source, and using a detector device to capture a respective intensity distribution in a diffraction image produced by the object in a plurality of measurement steps. The measurement steps differ from one another with respect to the illumination setting set by the illumination device. The method also includes determining at least one characteristic variable that is characteristic for the object on the basis of an iteratively performed comparison between the measurement values obtained within the scope of the measurement steps and model-based simulated values. The model-based simulated values are ascertained on the basis of a multiple layer model, in which the object is modeled by a multiple layer structure made of layers that are respectively separated from one another by an interface, wherein a location-dependent reflectivity is assigned to the interfaces.
Public/Granted literature
- US20210157243A1 METHOD AND ASSEMBLY FOR CHARACTERIZING A MASK OR A WAFER FOR MICROLITHOGRAPHY Public/Granted day:2021-05-27
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