Invention Grant
- Patent Title: Sequencing and stacking group selection for heating components
-
Application No.: US15733796Application Date: 2018-08-31
-
Publication No.: US11269275B2Publication Date: 2022-03-08
- Inventor: Duane A Koehler , Robert Yraceburu , Francisco Alcazar , Vladislav Shapoval
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Mannava & Kang
- International Application: PCT/US2018/049247 WO 20180831
- International Announcement: WO2020/046395 WO 20200305
- Main IPC: G03G15/20
- IPC: G03G15/20

Abstract:
According to examples, an apparatus may include a processor and a nontransitory computer readable medium storing machine readable instructions that when executed by the processor may cause the processor to receive a requested power demand from a first heating component and a second heating component, compare the requested power demand to a first threshold, and select a sequencing and stacking group of a plurality of sequencing and stacking groups for the first heating component and the second heating component corresponding to a result of the requested power demand being compared to the first threshold. The instructions may also cause the processor to control application of power to the first heating component and the second heating component according to the selected sequencing and stacking group.
Public/Granted literature
- US20210232070A1 SEQUENCING AND STACKING GROUP SELECTION FOR HEATING COMPONENTS Public/Granted day:2021-07-29
Information query