- Patent Title: Electronic device with a cover assembly having an adhesion layer
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Application No.: US16882361Application Date: 2020-05-22
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Publication No.: US11269374B2Publication Date: 2022-03-08
- Inventor: Matthew S. Rogers , Manish Mittal , Marta M. Giachino , Sawako Kamei
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; G02B1/14
Abstract:
A cover assembly for an electronic device has a cover member including a glass ceramic material. An adhesion layer couples an interior coating to the cover member. The adhesion layer includes an oxide-based layer, such as a silicon oxide-based layer, and a coupling agent.
Public/Granted literature
- US20210072789A1 ELECTRONIC DEVICE WITH A COVER ASSEMBLY HAVING AN ADHESION LAYER Public/Granted day:2021-03-11
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