Invention Grant
- Patent Title: Interconnected memory grid with bypassable units
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Application No.: US16856072Application Date: 2020-04-23
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Publication No.: US11269526B2Publication Date: 2022-03-08
- Inventor: Yoav Lossin , Ron Schneider , Elad Raz , Ilan Tayari , Eyal Nagar
- Applicant: Next Silicon Ltd
- Applicant Address: IL Tel Aviv
- Assignee: Next Silicon Ltd
- Current Assignee: Next Silicon Ltd
- Current Assignee Address: IL Tel Aviv
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F13/40 ; G11C29/00

Abstract:
A device for executing a software program by at least one computational device, comprising an interconnected computing grid, connected to the at least one computational device, comprising an interconnected memory grid comprising a plurality of memory units connected by a plurality of memory network nodes, each connected to at least one of the plurality of memory units; wherein configuring the interconnected memory comprises: identifying a bypassable memory unit; selecting a backup memory unit connected to a backup memory network node; configuring the respective memory network node connected to the bypassable memory unit to forward at least one memory access request, comprising an address in a first address range, to the backup memory network node; and configuring the backup memory network node to access the backup memory unit in response to the at least one memory access request, in addition to accessing the respective at least one memory unit connected thereto.
Public/Granted literature
- US20210334023A1 INTERCONNECTED MEMORY GRID WITH BYPASSABLE UNITS Public/Granted day:2021-10-28
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