Invention Grant
- Patent Title: Coil component
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Application No.: US16282706Application Date: 2019-02-22
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Publication No.: US11270835B2Publication Date: 2022-03-08
- Inventor: Ju Hwan Yang , Byung Soo Kang , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0084646 20180720
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/02 ; H01F27/29 ; H01F27/34

Abstract:
A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; a coil portion buried in the body, and having first and second lead-out portions; first and second external electrodes disposed on the bottom surface of the body and spaced apart from each other; via electrodes penetrating through the body and connecting the first and second lead-out portions and the first and second external electrodes to each other; a third external electrode including a pad portion disposed on the bottom surface of the body, and a connection portion extending to portions of the plurality of walls of the body, and spaced apart from the first and second external electrodes; a shielding layer including a cap portion disposed on the other surface of the body, and side wall portions respectively disposed on the plurality of walls of the body, and connected to the third external electrode; and an insulating layer disposed between the shielding layer and the body, and between the first to third external electrodes and the body.
Public/Granted literature
- US20200027647A1 COIL COMPONENT Public/Granted day:2020-01-23
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