Invention Grant
- Patent Title: Apparatus and method for handling wafer carrier doors
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Application No.: US16834290Application Date: 2020-03-30
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Publication No.: US11270900B2Publication Date: 2022-03-08
- Inventor: Tsung-Sheng Kuo , Yang-Ann Chu , Alan Yang , Vic Huang , Hsu-Shui Liu , Jiun-Rong Pai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/683 ; H01L21/68

Abstract:
An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.
Public/Granted literature
- US20200227283A1 APPARATUS AND METHOD FOR HANDLING WAFER CARRIER DOORS Public/Granted day:2020-07-16
Information query
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