Invention Grant
- Patent Title: Wafer processing method
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Application No.: US16916829Application Date: 2020-06-30
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Publication No.: US11270916B2Publication Date: 2022-03-08
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JPJP2019-128123 20190710
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/268 ; B23K26/364 ; H01L21/68 ; H01L23/544
Abstract:
A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.
Public/Granted literature
- US20210013101A1 WAFER PROCESSING METHOD Public/Granted day:2021-01-14
Information query
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