- Patent Title: Semiconductor devices and methods of forming semiconductor devices
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Application No.: US16910100Application Date: 2020-06-24
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Publication No.: US11270938B2Publication Date: 2022-03-08
- Inventor: Kai Kang , Yi Jiang , Curtis Chun-I Hsieh , Wanbing Yi , Juan Boon Tan
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Viering Jentschura & Partner MBB
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/283 ; H01L49/02 ; H01L45/00 ; G11C5/06 ; H01L43/12 ; H01L27/22 ; H01L27/24

Abstract:
A semiconductor device may be provided, including a base layer, an insulating layer arranged over the base layer, a memory structure arranged at least partially within the insulating layer, where the memory structure may include a first electrode, a second electrode, and an intermediate element between the first electrode and the second electrode, and a resistor arranged at least partially within the insulating layer, where the resistor may be arranged in substantially a same horizontal plane with one of the first electrode and the second electrode.
Public/Granted literature
- US20210407906A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES Public/Granted day:2021-12-30
Information query
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