Invention Grant
- Patent Title: System and method for providing mechanical isolation of assembled diodes
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Application No.: US16601150Application Date: 2019-10-14
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Publication No.: US11270983B2Publication Date: 2022-03-08
- Inventor: David Francis Courtney , Angel Mario Cano Garza
- Applicant: Semtech Corporation
- Applicant Address: US CA Camarillo
- Assignee: Semtech Corporation
- Current Assignee: Semtech Corporation
- Current Assignee Address: US CA Camarillo
- Agency: Jackson Walker LLP
- Agent Christopher J. Rourk
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L25/07 ; H01L23/14

Abstract:
A circuit, comprising a diode, a conductive upper support disposed on top of the diode and electrically coupled to the diode, a conductive lower support disposed underneath the diode and electrically coupled to the diode, a mechanical support disposed adjacent to the diode, the conductive upper support and the conductive lower support, an insulator disposed underneath the mechanical support, an upper terminal coupled to the mechanical support and electrically coupled to the conductive upper support and a lower terminal coupled to the insulator and electrically coupled to the conductive lower support.
Public/Granted literature
- US2627071A Feed plate for stapling machines Public/Granted day:1953-02-03
Information query
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