Invention Grant
- Patent Title: Method for forming fin field effect transistor device structure
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Application No.: US16837465Application Date: 2020-04-01
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Publication No.: US11271096B2Publication Date: 2022-03-08
- Inventor: Chien-Wei Lee , Yen-Ru Lee , Hsueh-Chang Sung , Yee-Chia Yeo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/02

Abstract:
A method for forming a fin field effect transistor device structure includes forming a fin structure over a substrate. The method also includes forming a gate structure across the fin structure. The method also includes forming a source/drain recess adjacent to the gate structure. The method also includes wet cleaning the source/drain recess in a first wet cleaning process. The method also includes treating the source/drain recess with a plasma process. The method also includes wet cleaning the source/drain recess in a second wet cleaning process after treating the source/drain recess via the plasma process. The method also includes growing a source/drain epitaxial structure in the source/drain recess.
Public/Granted literature
- US20210313443A1 METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE Public/Granted day:2021-10-07
Information query
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