Invention Grant
- Patent Title: Replacement metal gate process for vertical transport field-effect transistor with self-aligned shared contacts
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Application No.: US16813105Application Date: 2020-03-09
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Publication No.: US11271106B2Publication Date: 2022-03-08
- Inventor: Ruqiang Bao , Brent A. Anderson , ChoongHyun Lee , Hemanth Jagannathan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Randall Bluestone
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L21/8238 ; H01L29/66 ; H01L27/092

Abstract:
A semiconductor structure includes a substrate, a bottom source/drain region disposed on a top surface of the substrate, and a plurality of fins disposed over a top surface of the bottom source/drain region. The fins provide vertical transport channels for one or more vertical transport field-effect transistors. The semiconductor structure also includes at least one self-aligned shared contact disposed between an adjacent pair of the plurality of fins. The adjacent pair of the plurality of fins includes a first fin providing a first vertical transport channel for a first vertical transport field-effect transistor and a second fin providing a second vertical transport channel for a second vertical transport field-effect transistor.
Public/Granted literature
Information query
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