Invention Grant
- Patent Title: OLED package structure, OLED device, display device and method for fabricating OLED package structure
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Application No.: US16192860Application Date: 2018-11-16
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Publication No.: US11271184B2Publication Date: 2022-03-08
- Inventor: Donghui Yu , Wenjun Hou
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201711319957.2 20171212
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L27/32

Abstract:
The present disclosure provides an OLED package structure, OLED device, display device and method for fabricating OLED package structure. The OLED package structure includes a substrate, a cover plate and a first sealant layer. The substrate, the cover plate and the first sealant layer together delimiting a sealed space. The OLED package structure further includes a functional sealant layer formed by filling the sealed space with a functional sealant, and a second sealant layer formed by a second sealant disposed between the substrate and the functional sealant layer. The second sealant has a density less than a density of the functional sealant.
Public/Granted literature
- US20190181375A1 OLED PACKAGE STRUCTURE, OLED DEVICE, DISPLAY DEVICE AND METHOD FOR FABRICATING OLED PACKAGE STRUCTURE Public/Granted day:2019-06-13
Information query
IPC分类: