A radio communication apparatus includes a printed board, an RF circuit formed on one surface of the printed board and configured to generate an RF signal, a first transmission line configured to transmit the RF signal, a second transmission line configured to transmit a signal different from the RF signal, and an antenna formed on another surface of the printed board and configured to emit the RF signal. The antenna includes a plurality of dielectric substrates layered on the other surface of the printed board, a metal film formed on surfaces of the plurality of dielectric substrates, and a through hole formed in at least the dielectric substrate adjacent to the printed board. The first transmission line is disposed on the one surface of the printed board, and a part of the second transmission line is disposed between any of the plurality of layered dielectric substrates.