Invention Grant
- Patent Title: Connector assembly and method of manufacturing the same
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Application No.: US16839936Application Date: 2020-04-03
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Publication No.: US11271339B2Publication Date: 2022-03-08
- Inventor: Chang-Ho Lee , Keun Taek Lim
- Applicant: Tyco Electronics AMP Korea Co., Ltd.
- Applicant Address: KR Gyungsan-si
- Assignee: Tyco Electronics AMP Korea Co., Ltd.
- Current Assignee: Tyco Electronics AMP Korea Co., Ltd.
- Current Assignee Address: KR Gyungsan-si
- Agency: Barley Snyder
- Main IPC: H01R13/424
- IPC: H01R13/424 ; H01R43/20 ; H01R13/506
Abstract:
A connector assembly includes an inner housing, a substrate inserted into the inner housing, and a terminal position assurance (TPA) member supporting the substrate for the substrate not to be separated from the inner housing. The TPA member having a hot staking protrusion penetrating through the substrate and the inner housing.
Public/Granted literature
- US20210313727A1 Connector Assembly And Method Of Manufacturing The Same Public/Granted day:2021-10-07
Information query
