Invention Grant
- Patent Title: Semiconductor laser and electronic apparatus
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Application No.: US16960710Application Date: 2019-01-17
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Publication No.: US11271368B2Publication Date: 2022-03-08
- Inventor: Kota Tokuda , Hideki Watanabe , Takayuki Kawasumi
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2018-008955 20180123
- International Application: PCT/JP2019/001192 WO 20190117
- International Announcement: WO2019/146478 WO 20190801
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/20 ; H01S5/042 ; H01S5/22 ; H01S5/32 ; H01S5/30 ; H01S5/40 ; H01S5/343

Abstract:
A semiconductor laser according to one embodiment of the present disclosure includes a semiconductor stack. The semiconductor stack includes, in the following order, a first cladding layer, an active layer, one or a plurality of low-concentration impurity layers, a contact layer, and a second cladding layer that includes a transparent conductive material. The semiconductor stack further has, in a portion including the contact layer, a ridge extending in a stacked in-plane direction. Each low-concentration impurity layer has an impurity concentration of 5.0×1017 cm−3 or less, and a total thickness of the low-concentration impurity layer is 250 nm or more and 1000 nm or less. A distance between the second cladding layer and the low-concentration impurity layer closest to the second cladding layer is 150 nm or less.
Public/Granted literature
- US20210066887A1 SEMICONDUCTOR LASER AND ELECTRONIC APPARATUS Public/Granted day:2021-03-04
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