The present patent discloses a ventilation and heat dissipation box-type substation, which includes a substation box and a substation box roof, and the surroundings of the substation box roof located on the outside of the substation box and not higher than the height of the top of the substation box. The substation box is provided with a return air inlet, and the inside of the substation box roof is provided with an inner top plate that collects the heat in the substation box. A circulation fan is arranged on the top of the inner top plate and forms a circulation cavity with the substation box roof, and one end of the circulation cavity away from the circulation fan is connected with the outside of the substation box. The present patent effectively avoids the accumulation of heat, which affects the service life of electronic components.