Invention Grant
- Patent Title: Headphone earcup mount in continuous headband-spring headphone system
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Application No.: US17076903Application Date: 2020-10-22
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Publication No.: US11272287B2Publication Date: 2022-03-08
- Inventor: Bennett P. Daley , Eric Douglas Curtiss , Allen Timothy Graff , Richard Arthur Grebe
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: Bose Corporation
- Current Assignee: Bose Corporation
- Current Assignee Address: US MA Framingham
- Agency: Hoffman Warnick LLC
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R1/10

Abstract:
Various implementations include headphone systems. In one implementation, a headband for a headphone system, includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, the continuous spring section and the earcup mount forming an arcuate joint, and the earcup mount configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, the friction assembly linearly arranged across the arcuate joint and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section, where the friction assembly includes a coupler having a primary axis extending across the arcuate joint, where the earcup mount rotates off-axis relative to the primary axis of the coupler.
Public/Granted literature
- US20210044900A1 HEADPHONE EARCUP MOUNT IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM Public/Granted day:2021-02-11
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