Invention Grant
- Patent Title: Heating assembly, aerosol-generating device and a method for heating an aerosol-forming substrate
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Application No.: US16348593Application Date: 2017-11-17
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Publication No.: US11272578B2Publication Date: 2022-03-08
- Inventor: Jacques Robert , Jean-Yves Vollmer , Michel Bessant
- Applicant: PHILIP MORRIS PRODUCTS S.A.
- Applicant Address: CH Neuchatel
- Assignee: PHILIP MORRIS PRODUCTS S.A.
- Current Assignee: PHILIP MORRIS PRODUCTS S.A.
- Current Assignee Address: CH Neuchatel
- Agency: Mueting Raasch Group
- Priority: EP16199649 20161118
- International Application: PCT/EP2017/079535 WO 20171117
- International Announcement: WO2018/091627 WO 20180524
- Main IPC: H05B3/44
- IPC: H05B3/44 ; A24F40/46 ; A24F40/50 ; A24F42/10 ; A24F40/00 ; A24F40/57 ; H05B3/04 ; A24F40/20

Abstract:
The present invention relates to a heating assembly (10) of an aerosol-generating device for heating aerosol-forming substrate. The heating assembly comprises a chemical heating device (200) configured to generate primary heat by an exothermic chemical reaction and to supply the primary heat to an aerosol-forming substrate for heating the substrate. The heating assembly further comprises an electrical heating device (100) configured to electrically generate and supply secondary heat to the aerosol-forming substrate for heating the substrate. The invention further relates to an aerosol-generating device including such a heating assembly. A method for generating an aerosol by heating aerosol-forming substrate comprises at least one of a sequential or a parallel performance of the following steps: generating primary heat by an exothermic chemical reaction and supplying the primary heat to the aerosol-forming substrate for heating the substrate; and electrically generating secondary heat and supplying the secondary heat to the aerosol-forming substrate for further heating the substrate.
Public/Granted literature
- US20190269174A1 HEATING ASSEMBLY, AEROSOL-GENERATING DEVICE AND A METHOD FOR HEATING AN AEROSOL-FORMING SUBSTRATE Public/Granted day:2019-09-05
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