A wiring substrate includes an insulating layer having a front surface and a back surface and at least two wiring parts that are disposed at least on the front surface of the insulating layer and that are insulated from each other. At least one of the wiring parts is electrically isolated on the insulating layer. Each of the wiring parts includes a conductive base layer disposed on the front surface of the insulating layer, a conductive layer disposed on a front surface of the conductive base layer, and a conductive covering layer arranged to cover at least a portion of a front surface of the conductive layer, at least a portion of a side surface of the conductive base layer, and at least a portion of a side surface of the conductive layer. The conductive base layer and the conductive layer overlap and coincide with each other in plan view.